Aluminum nitride substrate
Aluminum nitride substrate
Aluminum nitride substrate
Aluminum nitride substrate
Aluminum nitride substrate

Aluminum Nitride Ceramic Substrate AlN Substrate

Aluminum nitride ceramic substrate is made of aluminum nitride powder as raw material and sintered after forming. It has excellent thermal conductivity, low dielectric constant and dielectric loss, reliable electrical insulation properties, excellent mechanical properties and corrosion resistance, and is widely used in communication devices, high brightness LED, power modules, etc.

  • Brand:

    ATCERA
  • Item NO.:

    AT-AIN-ZT-003
  • Materials

    AlN
  • Shapes

    Substrate
  • Applications

    Semiconductor
Aluminum nitride ceramic substrate

Properties of Aluminum Nitride Ceramic Substrate

 

1. With high thermal conductivity, up to 220W/(℃*m), small thermal expansion coefficient, only around 4*10-6/℃, thermal shock resistance is good.

 

 

2. Good electric insulation, high breakdown voltage, large current carrying capacity.

 

 

3. High mechanical strength, good toughness, strong resistance to mechanical impact.

 

 

4. It can resist erosion of various acid, alkali and other chemical substances, corrosion resistance is very good.

 

 

5. Low dielectric constant and dielectric loss can reduce the energy loss during signal transmission.

Applications of AlN Substrate

Applications of AlN Substrate

 

 

Aluminum nitride ceramic substrate has excellent thermal conductivity performance, it is mainly used in semiconductor, electronics and other microelectronics device manufacturing, as the substrate of chips and electronic components, including integrated circuit (IC), radio frequency (RF) devices, piezoelectric components, photoelectric components, sensors, MEMS and other micro electronic devices. As a high-performance material, aluminum nitride ceramic substrate can provide a stable support platform to ensure normal operation and performance of the components.

 

1. Laboratory analysis: Silicon nitride crucible can be used to heat and melt various materials, 1. LED chip: aluminum nitride ceramic substrate has excellent thermal conductivity and mechanical strength, can be used to manufacture high-brightness LED chip, greatly improve the luminous efficiency of LED.

 

 

2. Electronic components: aluminum nitride ceramic substrate can be used to manufacture a variety of high-power and high-performance electronic components, such as power semiconductor devices, microwave devices, sensors, radio frequency modules, etc., to achieve more stable working conditions and higher performance indicators.

 

 

3. Photoelectric devices: aluminum nitride ceramic substrate can be used in the manufacture of optoelectronic parts, including laser diodes, solar cells, photodetectors, optical communication devices, etc.

 

 

4. Thermal management devices: Aluminum nitride ceramic substrates can also be used to manufacture various types of thermal management devices, such as heat sink, cold plate, etc., to effectively control the temperature of electronic components and optoelectronic devices, thereby improving their reliability and life time.

 

Size Chart for Aluminum Nitride Ceramic Substrate

We are committed to delivering prime aluminum nitride substrate tailored to your exact specifications. Our dedicated team ensures meticulous adherence to your instructions, striving to exceed customer expectations. Additionally, we offer the flexibility of customized sizes to accommodate your unique requirements.

 

Drawings and parameter requirements shall be provided if customized design request.

 

Dimensional Tolerance
Item   AN-170 AN-200 AN-230
boundary dimension inch(max) 5.5"×7.5" 5.0"×7.0" 5.0"×7.0"
Tolerance ±1% NLT:±0.1mm ±1% NLT:±0.1mm ±1% NLT:±0.1mm
Thickness Size (mm) 0.25~1.5 0.25~1.5 0.25~0.635
Tolerance ±10% NLT:±0.04mm ±10% NLT:±0.04mm ±10% NLT:±0.04mm
Hole Size (mm) Φ0.2~ Φ0.2~ Φ0.2~
Tolerance ±0.6% NLT:±0.05mm ±0.6% NLT:±0.05mm ±0.6% NLT:±0.05mm
Rate of curving Tolerance 0.003/mm 0.003/mm 0.003/mm

 

 

Drawing of AlN Substrate AT-AIN-ZT-003

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-003 138*190.5*0.635mm ±0.1mm ±0.05mm 0.38mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-004

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-004 114.3*114.3*0.5mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-005

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-005 120*120*1.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-006

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-006 16*10*2.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-007

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-007 18.5*12*0.635mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-008

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-008 26*10*1.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-009

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-009 φ150*1.0mm ±0.1mm ±0.05mm 0.5mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-010

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-010 27*14.8*0.8mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Subtrate AT-AIN-ZT-011

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-011 28*13*0.254mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-012

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-012 30*12*0.5mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-013

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-013 30*28*2.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-014

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-014 32.1*17.8*0.38 ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-015

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-015 φ200*1.0mm ±0.1mm ±0.05mm 0.75mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Subatrate AT-AIN-ZT-016

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-016 35*21*1.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-017

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-017 37*26.5*1.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-018

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-018 42.4*42.4*0.64mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-019

 

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-019 40*12*0.635mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-020

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-020 40*40*1.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-021

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-021 40*40*1.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-022

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-022 19*14*1.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-023

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-023 42.4*42.4*0.64mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of  AlN Substrate AT-AIN-ZT-024

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-024 44.5*25.5*1.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-025

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-025 44*3.9*1.2mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-026

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-026 46*20*1.5mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-027

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-027 φ300*1.0mm ±0.1mm ±0.05mm 1.0mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of  AlN Substrate AT-AIN-ZT-028

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-028 48.5*29.6*1.5mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of  AlN Substrate AT-AIN-ZT-029

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-029 28*20.5*1.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-030

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-030 50*20*1.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-031

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-031 50*40*0.635mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-032

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-032 52*30.3*1.5mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-033

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-033 58*40*1.5mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-034

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-034 20*14*0.635mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-035

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-035 22*17*1.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-036

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-036 80*51*0.5mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-037

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-037 70.2*51*1.5mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-038

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-038 71*24*0.6mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-039

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-039 72*32*1.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-040

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-040 72*42*1.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-041

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-041 76.2*14.22*1.5mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-042

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-042 80*51*0.5mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-043

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-043 24*18.5*1.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-044

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-044 25*20*1.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-045

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-045 105*15*1.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-046

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-046 28*22*1.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-047

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-047 112*40*1.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-048

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-048 112*60*1.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-049

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-049 116.4*71.4*1.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-050

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-050 120*80*0.385mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-051

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-051 124*23*0.6mm ±0.1mm ±0.05mm 0.381mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-052

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-052 φ25*1.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-053

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-053 130*110*1.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-054

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-054 146.8*130.4*2.0mm ±0.1mm ±0.05mm 0.38mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-055

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-055 150*50*2.0mm ±0.1mm ±0.05mm 0.5mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-056

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-056 φ12*1.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-057

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-057 φ22.7*0.635mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-058

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-058 φ25*1.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-059

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-059 φ40*1.0mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-060

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-060 φ66*1.5mm ±0.1mm ±0.05mm 0.25mm-3.0mm Ra0.2-0.6 >170 >420

 

Drawing of AlN Substrate AT-AIN-ZT-061

Item NO. L × W × Thickness
(mm)
Tolerance of Length and Width
(mm)
Tolerance of Thickness
(mm)
Thickness Range
(mm)
Surface Roughness
(μm)
Thermal Conductivity
(25
, W/m.k)
Bending Strength
(MPa)
AT-AIN-ZT-061 198*158*10mm ±0.1mm ±0.05mm 5mm-20mm Ra0.2-0.6 >170 >420

 

Technical Data of Aluminum Nitride Materials

Si3N4 Type ALN-170 ALN-200
ALN-230
Density (g/cm3) 3.3 3.28 3.25
Flexture strength (MPa) 450 400 350
Young Modulus (GPa) 320 / /
Hardness (Hv) 1100 1100
1100
Fracture toughness (MPa*m1/2) 3 2.6 2.4
Maximum working temperature (℃) 1100 1100
1100
Thermal conductivity (W/m*K) 180 200
230
Thermal expansion coefficient (/℃) 4*10-6 4*10-6
4*10-6
Dielectric Constant (at 1MHz) 9 8.7
8.5
Breakdown Voltage (kV/mm) >15 >15
>15

 

*This chart illustrates the standard characteristics of the aluminum nitride materials commonly employed in the manufacturing of our AlN products and parts. Please be aware that the attributes of customized aluminum nitride products and parts may vary depending on the specific processes involved. Detailed parameter is decided by type and composition of stabilizing agent.

 

Usage Instructions

 
 
 
1. Collision and impact during use shall be to avoid damage.
 
 
2. Working temperature of aluminum nitride ceramic substrate shall be strictly controlled, long time over temperature working shall be avoided.
 
 
3. Aluminum nitride ceramic substrate has good corrosion resistance to acid, alkali, salt and other chemicals, but contact with strong acid, especially hydrofluoric acid shall be avoided.
 
 
4. The surface of aluminum nitride ceramic substrate is easy to be contaminated with dust and dirt, which may affect its performance and service life, therefore it shall be regularly cleaned during use to keep its surface clean and shiny.
 

Valuable Information

 

AlN Substrate Packing

AlN Substrate Packing

 

Aluminum nitride substrates are carefully packaged in appropriate containers to avoid any potential damage.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Customization Advantages
Customization Advantages

 

 

1. According to your application scenario, analyze the needs, choose the appropriate material and processing plan.

 

2. Professional team, quick response, can provide solutions and quotations within 24 hours after confirming the demand.

 

3. Flexible business cooperation mechanism, support at least one piece of quantity customization.

 

4. Quickly provide samples and test reports to confirm that the product meets your needs.

 

5. Provide product use and maintenance suggestions to reduce your cost of use.

Related Blog
Preparation Of Aluminum Nitride Substrate And Selection Of Sintering Additives
In the field of high-tech materials, aluminum nitride (AlN) ceramics, with its excellent thermal conductivity, excellent electrical insulation properties and excellent mechanical strength, have become the core material in key fields such as electronic packaging, power electronics and microwave communication equipment. However, the preparation of aluminum nitride substrate is a complex process...
Application Requirements Of Aluminum Nitride Substrate
Aluminum nitride (AlN) as an advanced ceramic material, because of its unique physical and chemical properties, has shown great application potential in electronic packaging, power electronics, high frequency communication and other fields. As a core component in these fields, aluminum nitride substrates not only have to meet the basic physical performance requirements, but also need to ...
Effect Of Bulk Density Of Granulated Powder On Sintering Densification Of Silicon Nitride Balls
  Si3N4 powder is the main raw material for the preparation of silicon nitride balls. Selecting the appropriate treatment method to obtain the powder with regular shape and uniform particle size distribution is the basis for the stable implementation of Si3N4 ceramic ball forming, sintering, processing and other processes. According to the different atomization methods, the spray gr...
Optimizing The Spray Granulation Process To Improve The Performance Of Si3N4 balls
Silicon nitride (Si3N4) balls show great potential in the field of high-speed, high-precision, long-life bearings due to their excellent properties, such as lightweight, self-lubricating, high insulation, non-magnetic, high elastic modulus and excellent corrosion resistance. This paper aims to discuss the optimization of the spray granulation process of Si3N4 powder, especially the press...
Silicon Nitride Ball: A New Choice For High-Tech Powder Grinding Media
With the rapid development of high-tech industry, the requirements for fineness, purity and consistency of powder materials are increasing. As a key component in the powder preparation process, the performance of grinding medium directly determines the quality of the final product. Traditionally, zirconia ceramic balls are widely used in the field of ultra-fine grinding because of their high bendi...
Application Performance And Advantage Analysis Of Silicon Nitride Ball In Ultrafine Grinding Field
With the rapid development of nanotechnology and ultrafine material science, the demand for high-purity and ultrafine powder is increasing day by day. Silicon nitride ball, with its excellent hardness, very low wear rate and good chemical stability, has gradually become the key grinding medium in the field of ultrafine grinding. The purpose of this paper is to systematically describe the performan...
Study On Performance Characteristics And Application Of Silicon Nitride Ball In Mechanical Engineering Field
With the rapid development of modern mechanical engineering technology, the requirements for material properties are increasingly stringent, especially under extreme conditions such as high temperature, high speed, strong corrosion, etc., traditional metal materials and polymer materials have been difficult to meet the needs. Silicon nitride (Si ₄) As an advanced ceramic material with excellent ov...
Sol-gel Polishing Technology: Challenges And Opportunities To Innovate Silicon Carbide Substrate Polishing
Silicon carbide, the emerging star of the semiconductor material industry, is gradually leading the innovation trend of microelectronics technology with its excellent performance indicators. Its unique thermal conductivity, far superior to traditional semiconductor materials, provides the possibility for efficient heat dissipation, especially in high-power electronic devices show unparalleled adva...
Application And Advantages Of Plasma Assisted Polishing In AlN Substrate Processing
Aluminum nitride (AlN) ceramics, as a material with excellent thermal conductivity, mechanical properties and electrical properties, have been widely used in large-scale integrated circuits and electronic packages in recent years. Its excellent properties make it an ideal cooling substrate and packaging material. However, due to the high hardness, high brittleness and low fracture toughness of alu...
Silicon Carbide Substrate Processing Challenges with Innovative Applications Of Metal Friction-induced Reaction Grinding Technology
In the field of semiconductor materials, silicon carbide (SiC) with its excellent thermal conductivity, wide band gap characteristics, high breakdown electric field strength and high electron mobility, is gradually becoming a research and development hotspot, leading the innovation of a new generation of electronic devices. As a substrate material for key components, the broad application prospect...

Related Products

FAQ

Although our primary focus is on advanced ceramic materials such as alumina, zirconia, silicon carbide, silicon nitride, aluminum nitride, and quartz ceramics, we are always exploring new materials and technologies. If you have a specific material requirement, please contact us, and we will do our best to fulfill your needs or find suitable partners.

Absolutely. Our technical team possesses profound knowledge of ceramic materials and extensive experience in product design. We are happy to provide you with material selection advice and product design support to ensure optimal performance for your products.

We do not have a fixed minimum order value requirement. We always focus on meeting our customers' needs, and we strive to provide quality service and products regardless of the order size.

In addition to ceramic products, we also provide a range of additional services, including but not limited to: customized ceramic processing services based on your needs, using blanks or semi-finished blanks produced by yourself; if you are interested in outsourced ceramic packaging and metallization services, please contact us for further discussion. We are always committed to providing you with a one-stop solution to meet your various needs.

Yes, we do. No matter where you are located globally, we can ensure the safe and timely delivery of your order.

Send Your inquiry

Upload
* File ONLY PDF/JPG./PNG. Available.
Submit Now

Contact With Us

Contact With Us
Simply fill out the form below as best you can. And don't sweat the details.
Submit
Looking for Video?
Contact Us #
19311583352

Office Hours

  • Monday to Friday: 9:00 AM - 12:00 PM, 2:00 PM - 5:30 PM

Please note that our office hours are based on Beijing Time, which is eight hours ahead of Greenwich Mean Time (GMT). We appreciate your understanding and cooperation in scheduling your inquiries and meetings accordingly. For any urgent matters or queries outside our regular hours, feel free to contact us via email, and we will get back to you as soon as possible. Thank you for your business, and we look forward to serving you.

Home

Products

whatsApp

contact