CQFP ceramic four-sided flat housing

CQFP Ceramic Four-Sided Flat Housing AlN HTCC Substrate

Aluminum nitride HTCC substrate is made of aluminum nitride as raw material with accurate thickness and good densification of raw ceramic sheet, using tungsten, molybdenum, manganese and other metal slurry, and the designed circuit diagram is formed on the raw ceramic sheet through drilling, micro-hole grouting, printing and other processes, and then laminated together and sintered at 1500℃~1850℃. Finally through electroplating, brazing and other processes, a monolithic structure of three-dimensional wiring system is formed. Aluminum nitride HTCC substrate has high mechanical strength, good heat dissipation performance, high temperature and corrosion resistance, high wiring density, it 's suitable for electronic components those need to work at high temperature environment, with high thermal stability requirements and large power.

  • Brand:

    ATCERA
  • Item NO.:

    AT-CQFP24A
  • Materials

    AlN
  • Shapes

    Substrate
  • Applications

    Semiconductor , Electronics and Electricity
CQFP ceramic four-sided flat housing

Properties of Aluminum Nitride CQFP Ceramic Four-Sided Flat Housing

 

It has small size, light weight, high package density, good thermoelectric performance, suitable for surface installation, and the commonly used lead pitch are 1.27mm, 1.00mm, 0.80mm, 0.65mm and 0.50mm, etc., suitable for various large-scale integrated circuit packages, such as ECL and CMOS gate array circuits.

 

 

 

 

 

 

 

 

Applications of AlN Substrate

Applications of AlN CQFP Ceramic Four-Sided Flat Housing

 

 

Aluminum nitride HTCC substrate is suitable for electronic components those need to work at high temperature environment, with high thermal stability requirements and large power, usually used as a high-voltage, high-power device packaging substrate, including power module, high-frequency switching power supply, relay, communication module, LED module, etc., widely used in new energy vehicles, rail transit, smart grid, aerospace and other fields.

 

 

 

 

 

 

 

 

 

 

 

 

Size Chart for CQFP Ceramic Four-Sided Flat Housing

We are committed to delivering prime aluminum nitride CQFP ceramic four-sided flat housing tailored to your exact specifications. Our dedicated team ensures meticulous adherence to your instructions, striving to exceed customer expectations. Additionally, we offer the flexibility of customized sizes to accommodate your unique requirements.

 

 

Please inquire ATCera for information or requesst.

 

 

 

 

CQFP Ceramic Four-Sided Flat Housing
Item no. Terminal number Leading end pitch Core cavity size Ceramic dimension Sealing form Whether it has heat sink
AT-CQFP24A 24 0.65 3.3*3.3 6.6*6.8 au-sn alloy yes
AT-CQFP28 28 1.27 7.6*7.6 12*12 au-sn alloy no
AT-CQFP28B 28 1.27 5.5*5.5 11.43*11.43 Flat seal yes
AT-CQFP28D 28 0.8 4.2*4.2 9*9 au-sn alloy yes
AT-CQFP28E 28 0.8 4.5*4.5 7*7 au-sn alloy yes
AT-CQFP28F 28 0.8 4.2*4.2 9*9 au-sn alloy yes
AT-CQFP40B 40 1.27 4.8*4.8 14.6*14.6 au-sn alloy no
AT-CQFP40D 40 0.5 4.6*4.6 11*11 au-sn alloy yes
AT-CQFP44 44 0.8 6.1*6.1 10*10 au-sn alloy no
AT-CQFP44B 44 0.8 6.4*6.4 10*10 au-sn alloy no
AT-CQFP44C 44 0.8 6.9*6.9 10*10 au-sn alloy no
AT-CQFP44E 44 0.8 5.13*5.13 10.6*10.6 au-sn alloy no
AT-CQFP44F 44 1.27 8.1*8.1 16.51*16.51 au-sn alloy no
AT-CQFP48A 48 0.5 4.2*4.2 8.5*8.5 au-sn alloy no
AT-CQFP48B 48 1 6*6 14.22*14.22 au-sn alloy no
AT-CQFP48C 48 1 8.9*8.9 14.22*14.22 au-sn alloy no
AT-CQFP48D 48 1 8.7*8.7 14.22*14.22 au-sn alloy no
AT-CQFP64A 64 0.8 5*5 14*5*14.5 au-sn alloy no
AT-CQFP64B 64 0.8 6.4*6.4 14.6*14.6 au-sn alloy no
AT-CQFP64C 64 1 5*5 18.4*18.4 au-sn alloy no
AT-CQFP64D 64 0.8 8*8 14.6*14.6 au-sn alloy no
AT-CQFP64E 64 1 9.2*9.2 18.4*18.4 au-sn alloy no
AT-CQFP64P 64 0.5 7*7 11*11 au-sn alloy no
AT-CQFP80A 80 0.5 7.8*7.8 12.2*12.2 au-sn alloy no
AT-CQFP84 84 1.27 15.1*15.1 29.3*29.3 au-sn alloy no
AT-CQFP100B 100 0.65 7.6*7.6 22*16 au-sn alloy no

 

 

 

 

Technical Data of Aluminum Nitride Materials

AlN Type ALN-170 ALN-200
ALN-230
Density (g/cm3) 3.3 3.28 3.25
Flexture strength (MPa) 450 400 350
Young Modulus (GPa) 320 / /
Hardness (Hv) 1100 1100
1100
Fracture toughness (MPa*m1/2) 3 2.6 2.4
Maximum working temperature (℃) 1100 1100
1100
Thermal conductivity (W/m*K) 180 200
230
Thermal expansion coefficient (/℃) 4*10-6 4*10-6
4*10-6
Dielectric Constant (at 1MHz) 9 8.7
8.5
Breakdown Voltage (kV/mm) >15 >15
>15

 

*This chart illustrates the standard characteristics of the aluminum nitride materials commonly employed in the manufacturing of our AlN products and parts. Please be aware that the attributes of customized aluminum nitride products and parts may vary depending on the specific processes involved. Detailed parameter is decided by type and composition of stabilizing agent.

 

 

 

Valuable Information

 

CQFP Ceramic Four-Sided Flat Housing Packing

CQFP Ceramic Four-Sided Flat Housing Packing

 

Aluminum nitride CQFP ceramic four-sided flat housings are carefully packaged in appropriate containers to avoid any potential damage.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Customization Advantages
Customization Advantages

 

 

1. According to your application scenario, analyze the needs, choose the appropriate material and processing plan.

 

2. Professional team, quick response, can provide solutions and quotations within 24 hours after confirming the demand.

 

3. Flexible business cooperation mechanism, support at least one piece of quantity customization.

 

4. Quickly provide samples and test reports to confirm that the product meets your needs.

 

5. Provide product use and maintenance suggestions to reduce your cost of use.

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Although our primary focus is on advanced ceramic materials such as alumina, zirconia, silicon carbide, silicon nitride, aluminum nitride, and quartz ceramics, we are always exploring new materials and technologies. If you have a specific material requirement, please contact us, and we will do our best to fulfill your needs or find suitable partners.

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