CDIP Ceramic Dual In-Line Housing

CDIP Ceramic Dual In-Line Housing AlN HTCC Substrate

Aluminum nitride HTCC substrate is made of aluminum nitride as raw material with accurate thickness and good densification of raw ceramic sheet, using tungsten, molybdenum, manganese and other metal slurry, and the designed circuit diagram is formed on the raw ceramic sheet through drilling, micro-hole grouting, printing and other processes, and then laminated together and sintered at 1500℃~1850℃. Finally through electroplating, brazing and other processes, a monolithic structure of three-dimensional wiring system is formed. Aluminum nitride HTCC substrate has high mechanical strength, good heat dissipation performance, high temperature and corrosion resistance, high wiring density, it 's suitable for electronic components those need to work at high temperature environment, with high thermal stability requirements and large power.

  • Brand:

    ATCERA
  • Item NO.:

    AT-DIP04B
  • Materials

    AlN
  • Shapes

    Substrate
  • Applications

    Semiconductor , Electronics and Electricity
CDIP Ceramic Dual In-Line Housing

Properties of Aluminum Nitride CDIP Ceramic Dual In-Line Housing

 

Ceramic dual-in-line shell is a plug-in shell, the general pin pitch is 2.54mm, the span is generally 15.24mm, 10.16mm and 7.62mm and other common specifications, the product is widely used in the number of leading end, assembly density requirements are not high all kinds of integrated circuits, optocouplers, MEMS and other packaging. There are parallel sealing welding and alloy solder sealing and other sealing methods to choose from.

 

 

 

 

 

 

 

 

Applications of AlN Substrate

Applications of AlN CDIP Ceramic Dual In-Line Housing

 

 

Aluminum nitride HTCC substrate is suitable for electronic components those need to work at high temperature environment, with high thermal stability requirements and large power, usually used as a high-voltage, high-power device packaging substrate, including power module, high-frequency switching power supply, relay, communication module, LED module, etc., widely used in new energy vehicles, rail transit, smart grid, aerospace and other fields.

 

 

 

 

 

 

 

 

 

 

 

 

Size Chart for CDIP Ceramic Dual In-Line Housing

We are committed to delivering prime aluminum nitride CDIP ceramic dual in-line housing tailored to your exact specifications. Our dedicated team ensures meticulous adherence to your instructions, striving to exceed customer expectations. Additionally, we offer the flexibility of customized sizes to accommodate your unique requirements.

 

 

Please inquire ATCera for information or requesst.

 

 

 

 

CDIP Ceramic Dual In-Line Housing
Item no. Terminal number Leading end pitch Core cavity size Ceramic dimension Sealing form Whether it has heat sink
AT-DIP04B 4 2.54 5.4*3.2 7.4*5.2 Flat seal no
AT-DIP04C 4 2.54 5.3*2.65 7.4*5.1 Flat seal no
AT-DIP04D 4 2.54 5.4*3.2 7.4*5.2 Flat seal no
AT-DIP04S2 4 2.54 5.0*2.6 7.3*5 Flat seal no
AT-DIP06B 6 2.54 6.6*5.4 8.4*7.4 Flat seal no
AT-DIP06C 6 2.54 6.6*5.4 8.51*7.49 Flat seal no
AT-DIP06D 6 2.54 6.6*5.4 8.4*7.4 Flat seal no
AT-DIP06E 6 2.54 5.16*4 9*7.4 Flat seal no
AT-DIP06S3 6 2.54 5.2*4.2 9.3*7.4 Flat seal no
AT-DIP08A 8 2.54 7.7*5.4 9.7*7.4 Flat seal no
AT-DIP08AL 8 2.54 10.08*7.37 8*5.72 Flat seal no
AT-DIP08M 8 2.54 17.1*6.6 19.46*9.91 Flat seal no
AT-DIP08S2 8 2.54 5.72*5.21 10.28*7.37 Flat seal no
AT-DIP12 12 2.54 5.6*3.8 15.24*7.37 Flat seal no
AT-DIP14 14 2.54 5.6*3.8 17.9*7.5 Flat seal no
AT-DIP16 16 2.54 5.6*4.32 20.32*7.37 Flat seal no
AT-DIP16A 16 2.54 5.59*4.19 20.32*7.42 Flat seal no
AT-DIP16B 16 2.54 5.6*3.8 20.32*7.5 Flat seal no
AT-DIP16C 16 2.54 5.4*4.5 23.6*7.4 Flat seal no
AT-DIP16S2 16 2.54 18.2*4.9 20.6*7.37 Flat seal no
AT-DIP20A 20 2.54 5.6*3.8 25.14*7.37 Flat seal no
AT-DIP24 24 2.54 5.75*3.8 30.48*7.49 Flat seal no
AT-DIP28A 28 2.54 5.6*4.2 40*25.1 Flat seal no
AT-DIP32 32 2.54 10*6.2 40.64*9.91 Flat seal no

 

Technical Data of Aluminum Nitride Materials

AlN Type ALN-170 ALN-200
ALN-230
Density (g/cm3) 3.3 3.28 3.25
Flexture strength (MPa) 450 400 350
Young Modulus (GPa) 320 / /
Hardness (Hv) 1100 1100
1100
Fracture toughness (MPa*m1/2) 3 2.6 2.4
Maximum working temperature (℃) 1100 1100
1100
Thermal conductivity (W/m*K) 180 200
230
Thermal expansion coefficient (/℃) 4*10-6 4*10-6
4*10-6
Dielectric Constant (at 1MHz) 9 8.7
8.5
Breakdown Voltage (kV/mm) >15 >15
>15

 

*This chart illustrates the standard characteristics of the aluminum nitride materials commonly employed in the manufacturing of our AlN products and parts. Please be aware that the attributes of customized aluminum nitride products and parts may vary depending on the specific processes involved. Detailed parameter is decided by type and composition of stabilizing agent.

 

 

 

Valuable Information

 

CDIP Ceramic Dual In-Line Housing Packing

CDIP Ceramic Dual In-Line Housing Packing

 

Aluminum nitride CDIP ceramic dual in-line housings are carefully packaged in appropriate containers to avoid any potential damage.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Customization Advantages
Customization Advantages

 

 

1. According to your application scenario, analyze the needs, choose the appropriate material and processing plan.

 

2. Professional team, quick response, can provide solutions and quotations within 24 hours after confirming the demand.

 

3. Flexible business cooperation mechanism, support at least one piece of quantity customization.

 

4. Quickly provide samples and test reports to confirm that the product meets your needs.

 

5. Provide product use and maintenance suggestions to reduce your cost of use.

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Although our primary focus is on advanced ceramic materials such as alumina, zirconia, silicon carbide, silicon nitride, aluminum nitride, and quartz ceramics, we are always exploring new materials and technologies. If you have a specific material requirement, please contact us, and we will do our best to fulfill your needs or find suitable partners.

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In addition to ceramic products, we also provide a range of additional services, including but not limited to: customized ceramic processing services based on your needs, using blanks or semi-finished blanks produced by yourself; if you are interested in outsourced ceramic packaging and metallization services, please contact us for further discussion. We are always committed to providing you with a one-stop solution to meet your various needs.

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