metalized Si3N4 substrate
metalized Si3N4 substrate
metalized Si3N4 substrate
metalized Si3N4 substrate
metalized Si3N4 substrate

AMB Silicon Nitride Substrate Metalized Si3N4 Substrate

Active metal brazing (AMB) silicon nitride substrate is a silicon nitride ceramic substrate with copper-bonded metalization, it has electrical function and high insulation properties, also with high temperature resistance, good thermal shock resistance and fast heat conductivity.AMB silicon nitride substrate is usually used as packaging substrate of high voltage, high power device, including power modules, high-frequency switching power supplies, relays, communication modules, LED modules, etc., particularly matches the third-generation semiconductor SiC power modules, which are widely used in electrical vehicles, rail transit, smart grid, aerospace and other fields.

  • Brand:

    ATCERA
  • Item NO.:

    AT-SIN-FT1001
  • Materials

    Si3N4
  • Shapes

    Substrate
  • Applications

    Semiconductor , Electronics and Electricity
AMB silicon nitride substrate

Properties of AMB Silicon Nitride Substrate

 

1. Thermal expansion coefficient of AMB silicon nitride substrate is close to that of silicon chip, with good thermal matching, which can save transition layer, reduce material and processing costs, and have high reliability of packaged components.

 

 

 

2. AMB silicon nitride substrate has high thermal conductivity and large current carrying capacity, which can make the chip package very compact, so that the power density is greatly improved, and the reliability of the system and device is improved.

 

 

 

silicon nitride ceramic substrate

Applications of Metalized Si3N4 Substrate

 

AMB silicon nitride substrate is usually used as packaging substrate of high voltage, high power device, including power modules, high-frequency switching power supplies, relays, communication modules, LED modules, etc., particularly matches the third-generation semiconductor SiC power modules, which are widely used in electrical vehicles, rail transit, smart grid, aerospace and other fields.

 

 

 

 

 

 

 

 

 

 

 

 

 

Size Chart of AMB Silicon Nitride Substrate

We are committed to delivering optimal AMB silicon nitride substrates tailored to your exact specifications. Our dedicated team ensures meticulous adherence to your instructions, striving to exceed customer expectations. Additionally, we offer the flexibility of customized sizes to accommodate your unique requirements.

 

The substrate diagram, PCB design diagram (not necessary if no etching request), as well as the metal material, layer number, thickness and other necessary parameters shall be provided if customized design request.

 

Copper layer surface roughness Ra≤1.5μm, Rz≤10μm, Rmax=50μm
Coating layer Nickel 2-10μm (P6%-10%)
Silver 0.1-1.0μm
Nickel-gold Ni: 2-10μm, Au: 0.01-0.15μm
Nickel-gold-palladium Ni: 2-10μm, Au: 0.01-0.15μm, Pd: 0.01-0.15μm
solder mask line width,space, tolerance ≥0.2mm, tolerance ±0.2mm
poisition tolerance ±0.2mm
thickness 5-40μm
temperature change endurance ≤320/10s

 

 

 

AMB Silicon Nitride Substrate
Item No. L*W
(mm)
Thickness of Ceramic
(mm)
Thickness of Metal
(mm)
AT-SIN-FT1001 10*10~127*178 0.25 0.127, 0.2, 0.25, 0.3, 0.4, 0.5, 0.8
AT-SIN-FT1002 0.32
AT-SIN-FT1003 0.38
AT-SIN-FT1004 0.63
AT-SIN-FT1005 1.0
AT-SIN-FT1006 others

 

 

 

Technical Data of Silicon Nitride Materials

Si3N4 Type Gas pressure sintering Si3N4 Hot pressing sintering Si3N4
Density (g/cm3) 3.2 3.3
Flexture strength (MPa) 700 900
Young Modulus (GPa) 300 300
Poisson's ratio 0.25 0.28
Compressive strength (MPa) 2500 3000
Hardness (GPa) 15 16
Fracture toughness (MPa*m1/2) 5~7 6~8
Maximum working temperature (℃) 1100 1300
Thermal conductivity (W/m*K) 20 25
Thermal expansion coefficient (/℃) 3*10-6 3.1*10-6
Thermal shock resistance (ΔT ℃) 550 800

 

*This chart illustrates the standard characteristics of the silicon nitride materials commonly employed in the manufacturing of our Si3N4 products and parts. Please be aware that the attributes of customized silicon nitride products  and parts may vary depending on the specific processes involved. Detailed parameter is decided by type and composition of stabilizing agent.

 

 

 

 

Usage Instructions

 
 
 
1.AMB silicon nitride substrate needs to avoid long-term exposure to high temperature environment, avoid contact with organic solvents, so as not to affect the performance.
 
 
 
2. Check whether surface of the substrate has scratches, cracks or other defects before use, and confirm that there are no defects.
 
 
 
3. Ensure that the AMB silicon nitride substrate is properly connected to the power supply and properly grounded, to prevent static electricity from damaging the substrate.
 

Valuable Information

 

AMB Silicon Nitride Substrate

AMB Silicon Nitride Substrate Packing

 

 

AMB silicon nitride substrates are carefully packaged in appropriate containers to avoid any potential damage.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Customization Advantages
Customization Advantages

 

 

1. According to your application scenario, analyze the needs, choose the appropriate material and processing plan.

 

2. Professional team, quick response, can provide solutions and quotations within 24 hours after confirming the demand.

 

3. Flexible business cooperation mechanism, support at least one piece of quantity customization.

 

4. Quickly provide samples and test reports to confirm that the product meets your needs.

 

5. Provide product use and maintenance suggestions to reduce your cost of use.

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FAQ

Although our primary focus is on advanced ceramic materials such as alumina, zirconia, silicon carbide, silicon nitride, aluminum nitride, and quartz ceramics, we are always exploring new materials and technologies. If you have a specific material requirement, please contact us, and we will do our best to fulfill your needs or find suitable partners.

Absolutely. Our technical team possesses profound knowledge of ceramic materials and extensive experience in product design. We are happy to provide you with material selection advice and product design support to ensure optimal performance for your products.

We do not have a fixed minimum order value requirement. We always focus on meeting our customers' needs, and we strive to provide quality service and products regardless of the order size.

In addition to ceramic products, we also provide a range of additional services, including but not limited to: customized ceramic processing services based on your needs, using blanks or semi-finished blanks produced by yourself; if you are interested in outsourced ceramic packaging and metallization services, please contact us for further discussion. We are always committed to providing you with a one-stop solution to meet your various needs.

Yes, we do. No matter where you are located globally, we can ensure the safe and timely delivery of your order.

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