Alumina wafer polishing carrier
Alumina wafer polishing carrier
Alumina wafer polishing carrier
Alumina wafer polishing carrier
Alumina wafer polishing carrier

Alumina wafer polishing carrier

Alumina wafer polishing carrier are made of high purity alumina with high surface accuracy and long service life, and can be used as carrier parts in grinding and chemical mechanical polishing (cmp) processes of wafers.

  • Brand:

    ATCERA
  • Item NO.:

    AT-BDT-B001
  • Materials

    Alumina
  • Shapes

    Plate

alumina wafer carrier

Advantages of Alumina Wafer Carrier

 

· Alumina wafer polishing carrier is made of 99.6% or more high-purity ultra-fine alumina powder, which is fired in a high temperature environment after molding. It is resistant to high temperature, wear and corrosion, and has no pollution to the wafer during grinding.

 

· The surface accuracy of the alumina wafer polishing carrier is high, and the flatness of the 800mm diameter disk can be controlled within 1.5 microns, which is conducive to improving the polishing accuracy of the wafer.

 

 

 

Alumina wafer polishing carrier

Applications of Alumina Wafer Carrier

 

Alumina wafer polishing carrier can be used as a carrier part in thinning, grinding and chemical mechanical polishing (cmp) processes for semiconductor wafers such as silicon wafers, gallium arsenide wafers and silicon carbide wafers

 

 

Size Chart of Al2O3 wafer polishing carrier

 

We are committed to delivering high-quality alumina ceramic wafer polishing carrier tailored to your exact specifications. Our dedicated team ensures meticulous adherence to your instructions, striving to exceed customer expectations. Additionally, we offer the flexibility of custom sizes to accommodate your unique requirements.

 

 

Alumina Wafer Carrier
Item No. Diameter (mm) Height(mm) Purity(%) Remark
AT-BDT-B001 240 15 99.5 Evenness and surface roughness are processed as required
AT-BDT-B002 240 25 99.6
AT-BDT-B003 245 25 99.6
AT-BDT-B004 263 25 99.6
AT-BDT-B005 300 20 99.6
AT-BDT-B006 310 20 99.6
AT-BDT-B007 350 15 99.5
AT-BDT-B008 355 16 99.6
AT-BDT-B009 360 16 99.6
AT-BDT-B010 400 15 99

 

Specification of Aluminium Oxide Materials

Material 99% Alumina (AL2O3)
Thermal Conductivity 24.0w/m.k
Electrical Insulation ≤22.5KV, temperature resistance up to 1600℃
Density 3.83g/cm3
Thermal Expansion Coefficient 7*10-6/℃
Bending Strength (at room temperature) 310MPa
Compressive Strength (at room temperature) 2200MPa
Hardness (Hv) 1650
Fracture Toughness 4.2MPa*m1/2

*This chart illustrates the standard characteristics of the alumina materials commonly employed in the manufacturing of our alumina products and parts. Please be aware that the attributes of customized aluminum oxide products  and parts may vary depending on the specific processes involved.

 

 

Usage Instructions

1. Keep the alumina wafer polishing carrier clean before use. Clean it with a soft cloth or sponge. Avoid using hard objects such as brushes to avoid scratching the surface. Do not use cleaners containing abrasive, acid, alkali, organic solvent or other corrosive substances;
2. When the alumina wafer polishing carrier is used, it should be handled gently to avoid falling or being impacted, so as not to cause rupture or deformation;
3. When not used for a long time, the alumina wafer polishing carrier should be stored in a dry and dust-free place to avoid exposure to humid environments and avoid contact with corrosive substances;
4. In the process of use or storage, it is necessary to avoid contact with sharp objects or be cut, scratched and other damage.
 

 

Valuable Information

 

Process for Customized Request

Process for Customized Request

 

1. Drawing and sample providing

2. Production solution and fabrication method evaluation

3. Calculation and quotation module cost payment

4. Sample delivery

5. Sample evaluation and confirmation

6. Down payment of bulk order 

7. Mass production

8. Batch product delivery

Customization Advantages
Customization Advantages

 

 

1. According to your application scenario, analyze the needs, choose the appropriate material and processing plan.

 

2. Professional team, quick response, can provide solutions and quotations within 24 hours after confirming the demand.

 

3. Flexible business cooperation mechanism, support at least one piece of quantity customization.

 

4. Quickly provide samples and test reports to confirm that the product meets your needs.

 

5. Provide product use and maintenance suggestions to reduce your cost of use.

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FAQ

Although our primary focus is on advanced ceramic materials such as alumina, zirconia, silicon carbide, silicon nitride, aluminum nitride, and quartz ceramics, we are always exploring new materials and technologies. If you have a specific material requirement, please contact us, and we will do our best to fulfill your needs or find suitable partners.

Absolutely. Our technical team possesses profound knowledge of ceramic materials and extensive experience in product design. We are happy to provide you with material selection advice and product design support to ensure optimal performance for your products.

We do not have a fixed minimum order value requirement. We always focus on meeting our customers' needs, and we strive to provide quality service and products regardless of the order size.

In addition to ceramic products, we also provide a range of additional services, including but not limited to: customized ceramic processing services based on your needs, using blanks or semi-finished blanks produced by yourself; if you are interested in outsourced ceramic packaging and metallization services, please contact us for further discussion. We are always committed to providing you with a one-stop solution to meet your various needs.

Yes, we do. No matter where you are located globally, we can ensure the safe and timely delivery of your order.

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