Metalized aluminum nitride ceramic substrate is an aluminum nitride ceramic substrate with copper-bonded metalization, it has electrical function and high insulation properties, also with high temperature resistance, good thermal shock resistance and fast heat conductivity. It is usually used as packaging substrate of high voltage, high power device, including power modules, high-frequency switching power supplies, relays, communication modules, LED modules, etc., which are widely used in electrical vehicles, rail transit, smart grid, aerospace and other fields.
Metalized aluminum nitride ceramic substrate can obtained by a variety of processes, combined with DBC (direct bond copper) process, that is, to form DBC aluminum nitride ceramic copper substrate, combined with DPC (direct plated copper) process to obtain DPC aluminum nitride copper substrate. Besides, TFC (thin film composite) and AMB (active metal brazing) processes can also be used, TFC aluminum nitride copper substrate and AMB aluminum nitride copper substrate are formed respectively.