sic honeycomb ceramic
sic honeycomb ceramic
sic honeycomb ceramic
sic honeycomb ceramic
sic honeycomb ceramic

Silicon Carbide Honeycomb Ceramic Heat Accumulator

Silicon carbide honeycomb ceramic is produced with silicon carbide powder as raw materials, sintered after forming, it has high mechanical strength and thermal conductivity, high temperature and corrosion resistance. The internal is of porous structure, high porosity, large specific surface area, can be used as a filter and catalyst carrier used for automobile exhaust purification, it can also be used as a regenerative oxidizer heat accumulator.

  • Brand:

    ATCERA
  • Item NO.:

    AT-SIC-FW001
  • Materials

    SiC
  • Shapes

    Mechanical Parts
  • Applications

    Petrochemical Industry , Biology and Medicine
sic ceramic honeycomb ceramic

Properties of Silicon Carbide Honeycomb Ceramic Heat Accumulator

 

 

1. Silicon carbide honeycomb ceramic is resistant to high temperature and corrosion, the highest working temperature can reach higher than 1300℃, it also has good oxidation resistance, can adapt to harsh working environment.

 

 

2. Silicon carbide honeycomb ceramic has high porosity, large specific surface area, high mechanical strength, stable structure, and is not easy to break.

 

 

3. Silicon carbide honeycomb ceramic has high thermal conductivity and fast heat exchange, which is conducive to improving catalytic efficiency and heat exchange speed.

sic heat accumulator

Applications of SiC Honeycomb Ceramic Heat Accumulator

 

 

 

1. Silicon carbide honeycomb ceramic can be used as a filter and catalyst carrier, used for automobile exhaust purification, it can intercept, capture diesel exhaust carbon smoke particles, and CO, NO and other harmful components in the exhaust can be generated into harmless components for discharge, it is widely used in a variety of diesel engine powered vehicle exhaust treatment, including diesel cars, heavy trucks, mine operation vehicles and forklifts.

 

 

2. It can also be used as a heat accumulator of a regenerative oxidizer to absorb and store the heat energy in the high-temperature exhaust gas, and transfer the heat energy to other process fluids through heat exchange to improve the utilization efficiency of fuel.

 

 

 

 

 

 

Size Chart for Silicon Carbide Honeycomb Ceramic Heat Accumulator

We are committed to delivering optimal silicon carbide honeycomb ceramic heat accumulators tailored to your exact specifications. Our dedicated team ensures meticulous adherence to your instructions, striving to exceed customer expectations. Additionally, we offer the flexibility of customized sizes to accommodate your unique requirements.

 

 

 

 

Operation environment information, drawing and parameter requirements shall be provided if customized design request.

 

Dimension tolerance: ±2mm.

 

Silicon Carbide Honeycomb Ceramic Heat Accumulator
Item NO. Diameter of Section
(mm)
Cross-sectional Area
(mm2)
Height
(mm)
AT-SIC-FW001 118.4 11010 ≤200
AT-SIC-FW002 127 12667
AT-SIC-FW003 144 16286
AT-SIC-FW004 150 17671
AT-SIC-FW005 190 28352
AT-SIC-FW006 228 40828
AT-SIC-FW007 240 45238
AT-SIC-FW008 267 55990
AT-SIC-FW009 286 64242
AT-SIC-FW010 305 73061
AT-SIC-FW011 330 85529

 

 

 

 

Technical Data of Silicon Carbide Materials

 

Item Unit Index Data
Reaction-sintered SiC
(SiSiC)
Silicon Nitride Bonded With SiC
(NBSiC)
Sintered SiCn Without Pressure
(SSiC)
SiC Content % 85 80 99
Free  Silicon Content % 15 0 0
Max. Service Temp. 1380 1550 1600
Density g/cm3 3.02 2.72 3.1
Porosity % 0 12 0
Bending Strength 20℃ Mpa 250 160 380
1200℃ Mpa 280 180 400
Modulus of Elasticity 20℃ Gpa 330 220 420
1200℃ Gpa 300 / /
Thermal Conductivity 1200℃ W/m.k 45 15 74
Coefficient of Thermal Expansion K-1×10-6 4.5 5 4.1
Vickers Hardness HV kg/mm2 2500 2500 2800

 

 

*This chart illustrates the standard characteristics of the silicon carbide materials commonly employed in the manufacturing of our SiC products and parts. Please be aware that the attributes of customized silicon carbide products and parts may vary depending on the specific processes involved.

 

 

 

 

Usage Instructions

 
 
 
1. Avoid violent impact during silicon carbide honeycomb ceramic delivery, installation and use period, to prevent damage or fracture.
 
 
 
2. Silicon carbide honeycomb ceramic storage needs to avoid high humidity environment, keep the package intact, avoid dust or debris entering into it.
 
 
 
3. Silicon carbide honeycomb ceramic needs regular cleaning and maintenance during long-term use, and damaged modules need to be replaced in time.
 

Valuable Information

 

Silicon Carbide Ceramic Heat Accumulator Packing

Silicon Carbide Honeycomb Ceramic Heat Accumulator Packing

 

 

 

 

Silicon carbide honeycomb ceramic heat accumulators are carefully packaged in appropriate containers to avoid any potential damage.

 

 

 

 

 

 

 

 

Customization Advantages
Customization Advantages

 

 

1. According to your application scenario, analyze the needs, choose the appropriate material and processing plan.

 

2. Professional team, quick response, can provide solutions and quotations within 24 hours after confirming the demand.

 

3. Flexible business cooperation mechanism, support at least one piece of quantity customization.

 

4. Quickly provide samples and test reports to confirm that the product meets your needs.

 

5. Provide product use and maintenance suggestions to reduce your cost of use.

Related Blog
Silicon Carbide Substrate Processing Challenges with Innovative Applications Of Metal Friction-induced Reaction Grinding Technology
In the field of semiconductor materials, silicon carbide (SiC) with its excellent thermal conductivity, wide band gap characteristics, high breakdown electric field strength and high electron mobility, is gradually becoming a research and development hotspot, leading the innovation of a new generation of electronic devices. As a substrate material for key components, the broad application prospect...
Exploration Of Laser Processing Technology Of AlN Substrate To Realize High Quality Flat Machining Surface
With the rapid development of electronic technology, the integration and performance requirements of large-scale integrated circuits are increasing day by day. As a key supporting material, aluminum nitride ceramics have become an ideal cooling substrate and packaging material because of their excellent thermal conductivity, mechanical strength, corrosion resistance and excellent electrical proper...
ELID Grinding Process Of AlN Substrate: Solving The Difficult Problem Of Machining High-hardness Brittleness
With the rapid development of microelectronics technology, the requirements for electronic packaging materials are increasingly stringent. Aluminum nitride ceramics, with its excellent thermal conductivity, excellent mechanical properties, corrosion resistance and excellent electrical properties, become the leader of large-scale integrated circuit cooling substrate and packaging materials. However...
AlN Ceramic Magnetorheological Polishing Process Achieves High-Quality Surface For AlN Substrate
Today, with the rapid development of the electronics industry, aluminum nitride ceramics have become the first choice for large-scale integrated circuit cooling substrates and packaging materials because of their excellent thermal conductivity, excellent mechanical properties, corrosion resistance and good electrical properties. Especially in the pursuit of miniaturization and high performance int...
Chemical Mechanical Polishing Of AlN Substrate: The Key Path To Overcome Micro-cracks And Subsurface Damage
In the field of microelectronic packaging, aluminum nitride ceramics are gradually becoming the preferred material for high-performance chip cooling substrates due to their excellent thermal conductivity, mechanical strength and electrical properties. However, its high hardness and high brittleness can easily cause surface micro-cracks and sub-surface damage during processing, which directly affec...
Study On Thermal Conductivity Of Aluminum Nitride Substrate And Analysis Of Influence Of Oxygen Impurity
For a long time, most of the substrate materials of high-power hybrid integrated circuits have been using Al2O3 and BeO ceramics, but the thermal conductivity of the Al2O3 substrate is low, and the thermal expansion coefficient is not well matched with Si. Although the comprehensive performance of BeO is excellent, its high production cost and highly toxic shortcomings limit its application and pr...
Evolution Of Ceramic Substrate Materials: Breakthroughs From Alumina To Aluminum Nitride And Silicon Nitride
In today's rapidly changing electronics industry, ceramic substrate materials as a key basis for supporting high-performance electronic devices, its performance and characteristics directly affect the overall performance and reliability of electronic products. From the early alumina ceramics to the later aluminum nitride, silicon nitride and other new materials, the development of ceramic substrat...
The Applicability of Aluminum Nitride Substrate as a Packaging Material for Enhancing Heat Dissipation in Power Devices
With the rapid development of electronic technology, the comprehensive performance of electronic chips is improving day by day, but the overall size is shrinking. This trend brings significant performance improvements, but it also comes with a serious challenge - a dramatic increase in heat flux. For electronic devices, even a small increase in temperature can have a significant impact on their pe...
Thermal Conductivity Improvement of Silicon Nitride Substrate
In the field of advanced ceramic materials, silicon nitride (Si3N4) has attracted much attention for its excellent mechanical strength, chemical stability and high temperature properties. However, the thermal conductivity of silicon nitride ceramics, as one of the key factors affecting its wide application, has been an important subject in materials science research. This paper aims to investigate...
Exploring Lattice Vibration Mechanism And Sintering Assistant Strategy Of Silicon Nitride Substrates
In cutting-edge technologies such as high-performance electronic packaging, aerospace and energy conversion, silicon nitride (Si3N4) substrate materials are highly regarded for their excellent mechanical properties, chemical stability and high temperature resistance. However, the thermal conductivity of silicon nitride, as one of the key factors affecting its wide application, has always been...

Related Products

FAQ

Although our primary focus is on advanced ceramic materials such as alumina, zirconia, silicon carbide, silicon nitride, aluminum nitride, and quartz ceramics, we are always exploring new materials and technologies. If you have a specific material requirement, please contact us, and we will do our best to fulfill your needs or find suitable partners.

Absolutely. Our technical team possesses profound knowledge of ceramic materials and extensive experience in product design. We are happy to provide you with material selection advice and product design support to ensure optimal performance for your products.

We do not have a fixed minimum order value requirement. We always focus on meeting our customers' needs, and we strive to provide quality service and products regardless of the order size.

In addition to ceramic products, we also provide a range of additional services, including but not limited to: customized ceramic processing services based on your needs, using blanks or semi-finished blanks produced by yourself; if you are interested in outsourced ceramic packaging and metallization services, please contact us for further discussion. We are always committed to providing you with a one-stop solution to meet your various needs.

Yes, we do. No matter where you are located globally, we can ensure the safe and timely delivery of your order.

Send Your inquiry

Upload
* File ONLY PDF/JPG./PNG. Available.
Submit Now

Contact With Us

Contact With Us
Simply fill out the form below as best you can. And don't sweat the details.
Submit
Looking for Video?
Contact Us #
19311583352

Office Hours

  • Monday to Friday: 9:00 AM - 12:00 PM, 2:00 PM - 5:30 PM

Please note that our office hours are based on Beijing Time, which is eight hours ahead of Greenwich Mean Time (GMT). We appreciate your understanding and cooperation in scheduling your inquiries and meetings accordingly. For any urgent matters or queries outside our regular hours, feel free to contact us via email, and we will get back to you as soon as possible. Thank you for your business, and we look forward to serving you.

Home

Products

whatsApp

contact