alumina fiber board
alumina fiber board
alumina fiber board
alumina fiber board
alumina fiber board

Alumina Ceramic Fiber Board

The alumina ceramic fiber board is primarily composed of alumina, boasting high strength, excellent erosion resistance, ease of processing and cutting, light weight, and outstanding thermal insulation properties. It is widely utilized in high-temperature insulation applications and effectively withstands direct impact from high-temperature airflows and flames.

  • Brand:

    ATCERA
  • Item NO.:

    AT-AO-XW1001
  • Materials

    Alumina
  • Shapes

    Plate
  • Applications

    Metallurgy Industry
aluminum oxide fiber board

Properties of Alumina Ceramic Fiber Board

 

 

 

1. With low thermal conductivity, high temperature resistance, flame and airflow erosion resistance, the alumina ceramic fiber board can be directly used on hot surfaces and exhibits excellent thermal shock resistance.

 

 

 

2. The alumina ceramic fiber board features low density, light weight, ease of processing and cutting, as well as convenient installation.

ceramic fiber board

Applications of Alumina Ceramic Fiber Board

 

 

 

1. Alumina ceramic fiber board can be used for furnace doors, linings, or backings in high-temperature kilns, flame barriers, and sealing materials.

 

 

2. As a thermal insulation and electrical insulation material for heating devices.

 

 

3. As a thermal insulation layer for molten metal ladles, such as steel ladles.

 

 

 

 

 

Size Chart for Alumina Ceramic Fiber Board 

 

We are committed to delivering optimal alumina fiber boards tailored to your exact specifications. Our dedicated team ensures meticulous adherence to your instructions, striving to exceed customer expectations. Additionally, we offer the flexibility of custom sizes to accommodate your unique requirements.

 

Please provide parameters such as dimensions and operating temperature for customization.

 

 

Alumina Ceramic Fiber Board
Item no. Length
(mm)
Width
(mm)
Thickness
(mm)
Operating Temperature
(
)
SiO2+Al2O3
(%)
AT-AO-XW1001 600 400 20-150 1000℃-1800℃ 96%-99.8%
AT-AO-XW1002 900 600 20—150 1000℃-1800℃ 96%-99.8%
AT-AO-XW1003 1000 500 20-150 1000℃-1800℃ 96%-99.8%
AT-AO-XW1004 1000 600 20-150 1000℃-1800℃ 96%-99.8%
AT-AO-XW1005 1100 700 10-150 1000℃-1800℃ 96%-99.8%
AT-AO-XW1006 1200 1000 10—150 1000℃-1800℃ 96%-99.8%

 

 

 

Technical Data of Aluminium Oxide Materials

Material 99% Alumina (AL2O3)
Thermal Conductivity 24.0w/m.k
Electrical Insulation ≤22.5KV, temperature resistance up to 1600℃
Density 3.83g/cm3
Thermal Expansion Coefficient 7*10-6/℃
Bending Strength (at room temperature) 310MPa
Compressive Strength (at room temperature) 2200MPa
Hardness (Hv) 1650
Fracture Toughness 4.2MPa*m1/2

 

*This chart illustrates the standard characteristics of the alumina materials commonly employed in the manufacturing of our alumina products and parts. Please be aware that the attributes of customized aluminum oxide products and parts may vary depending on the specific processes involved.

 

 

 

 

 
 

Usage Instructions

 
 
 
 
1. Alumina ceramic fiberboard should be stored in a room temperature and dry environment, avoiding direct sunlight or high-temperature and high-humidity conditions. It should not be exposed to rainwater.
 
 
 
 
2. Before use, do not remove the protective layer of the alumina fiberboard to prevent dust and impurities from entering.

Valuable Information

 

Alumina Ceramic Fiber Board Packing

Alumina Ceramic Fiber Board Packing

 

 

Alumina fiber boards are carefully packaged in appropriate containers to avoid any potential damage.

 

 

 

 

 

 

 

Customization Advantages
Customization Advantages

 

 

1. According to your application scenario, analyze the needs, choose the appropriate material and processing plan.

 

2. Professional team, quick response, can provide solutions and quotations within 24 hours after confirming the demand.

 

3. Flexible business cooperation mechanism, support at least one piece of quantity customization.

 

4. Quickly provide samples and test reports to confirm that the product meets your needs.

 

5. Provide product use and maintenance suggestions to reduce your cost of use.

Related Blog
Silicon Carbide Substrate Processing Challenges with Innovative Applications Of Metal Friction-induced Reaction Grinding Technology
In the field of semiconductor materials, silicon carbide (SiC) with its excellent thermal conductivity, wide band gap characteristics, high breakdown electric field strength and high electron mobility, is gradually becoming a research and development hotspot, leading the innovation of a new generation of electronic devices. As a substrate material for key components, the broad application prospect...
Exploration Of Laser Processing Technology Of AlN Substrate To Realize High Quality Flat Machining Surface
With the rapid development of electronic technology, the integration and performance requirements of large-scale integrated circuits are increasing day by day. As a key supporting material, aluminum nitride ceramics have become an ideal cooling substrate and packaging material because of their excellent thermal conductivity, mechanical strength, corrosion resistance and excellent electrical proper...
ELID Grinding Process Of AlN Substrate: Solving The Difficult Problem Of Machining High-hardness Brittleness
With the rapid development of microelectronics technology, the requirements for electronic packaging materials are increasingly stringent. Aluminum nitride ceramics, with its excellent thermal conductivity, excellent mechanical properties, corrosion resistance and excellent electrical properties, become the leader of large-scale integrated circuit cooling substrate and packaging materials. However...
AlN Ceramic Magnetorheological Polishing Process Achieves High-Quality Surface For AlN Substrate
Today, with the rapid development of the electronics industry, aluminum nitride ceramics have become the first choice for large-scale integrated circuit cooling substrates and packaging materials because of their excellent thermal conductivity, excellent mechanical properties, corrosion resistance and good electrical properties. Especially in the pursuit of miniaturization and high performance int...
Chemical Mechanical Polishing Of AlN Substrate: The Key Path To Overcome Micro-cracks And Subsurface Damage
In the field of microelectronic packaging, aluminum nitride ceramics are gradually becoming the preferred material for high-performance chip cooling substrates due to their excellent thermal conductivity, mechanical strength and electrical properties. However, its high hardness and high brittleness can easily cause surface micro-cracks and sub-surface damage during processing, which directly affec...
Study On Thermal Conductivity Of Aluminum Nitride Substrate And Analysis Of Influence Of Oxygen Impurity
For a long time, most of the substrate materials of high-power hybrid integrated circuits have been using Al2O3 and BeO ceramics, but the thermal conductivity of the Al2O3 substrate is low, and the thermal expansion coefficient is not well matched with Si. Although the comprehensive performance of BeO is excellent, its high production cost and highly toxic shortcomings limit its application and pr...
Evolution Of Ceramic Substrate Materials: Breakthroughs From Alumina To Aluminum Nitride And Silicon Nitride
In today's rapidly changing electronics industry, ceramic substrate materials as a key basis for supporting high-performance electronic devices, its performance and characteristics directly affect the overall performance and reliability of electronic products. From the early alumina ceramics to the later aluminum nitride, silicon nitride and other new materials, the development of ceramic substrat...
The Applicability of Aluminum Nitride Substrate as a Packaging Material for Enhancing Heat Dissipation in Power Devices
With the rapid development of electronic technology, the comprehensive performance of electronic chips is improving day by day, but the overall size is shrinking. This trend brings significant performance improvements, but it also comes with a serious challenge - a dramatic increase in heat flux. For electronic devices, even a small increase in temperature can have a significant impact on their pe...
Thermal Conductivity Improvement of Silicon Nitride Substrate
In the field of advanced ceramic materials, silicon nitride (Si3N4) has attracted much attention for its excellent mechanical strength, chemical stability and high temperature properties. However, the thermal conductivity of silicon nitride ceramics, as one of the key factors affecting its wide application, has been an important subject in materials science research. This paper aims to investigate...
Exploring Lattice Vibration Mechanism And Sintering Assistant Strategy Of Silicon Nitride Substrates
In cutting-edge technologies such as high-performance electronic packaging, aerospace and energy conversion, silicon nitride (Si3N4) substrate materials are highly regarded for their excellent mechanical properties, chemical stability and high temperature resistance. However, the thermal conductivity of silicon nitride, as one of the key factors affecting its wide application, has always been...

Related Products

FAQ

Although our primary focus is on advanced ceramic materials such as alumina, zirconia, silicon carbide, silicon nitride, aluminum nitride, and quartz ceramics, we are always exploring new materials and technologies. If you have a specific material requirement, please contact us, and we will do our best to fulfill your needs or find suitable partners.

Absolutely. Our technical team possesses profound knowledge of ceramic materials and extensive experience in product design. We are happy to provide you with material selection advice and product design support to ensure optimal performance for your products.

We do not have a fixed minimum order value requirement. We always focus on meeting our customers' needs, and we strive to provide quality service and products regardless of the order size.

In addition to ceramic products, we also provide a range of additional services, including but not limited to: customized ceramic processing services based on your needs, using blanks or semi-finished blanks produced by yourself; if you are interested in outsourced ceramic packaging and metallization services, please contact us for further discussion. We are always committed to providing you with a one-stop solution to meet your various needs.

Yes, we do. No matter where you are located globally, we can ensure the safe and timely delivery of your order.

Send Your inquiry

Upload
* File ONLY PDF/JPG./PNG. Available.
Submit Now

Contact With Us

Contact With Us
Simply fill out the form below as best you can. And don't sweat the details.
Submit
Looking for Video?
Contact Us #
19311583352

Office Hours

  • Monday to Friday: 9:00 AM - 12:00 PM, 2:00 PM - 5:30 PM

Please note that our office hours are based on Beijing Time, which is eight hours ahead of Greenwich Mean Time (GMT). We appreciate your understanding and cooperation in scheduling your inquiries and meetings accordingly. For any urgent matters or queries outside our regular hours, feel free to contact us via email, and we will get back to you as soon as possible. Thank you for your business, and we look forward to serving you.

Home

Products

whatsApp

contact